3D Glass Photonic (3D GP) Research Vision and Strategy
3D Glass Photonics (3D GP) is a concept being developed by Georgia Tech to achieve bandwidth beyond electronic TSVs in 3D ICs by ultra-thin 3D glass interposer technology with ICs on both sides of 3D glass interposer, targeting both chip-to-chip ultra-high performance computing and long-haul telecommunications. 3D GP utilizes ultra-thin and ultra-low loss 3D glass interposers with ultra-short and ultra-high density optical vias to achieve high bandwidth optical interconnections at low power, high alignment tolerance, and low cost from panel-based processing.
The 3D GP technology proposed by Georgia Tech PRC aims to balance and optimize energy efficiency, density, and cost.
The objective of the 3DGP program in 2014-2016 is to demonstrate a low-cost 3D glass photonic substrate with Tbps/mm2 density and pJ/bit energy efficiency. The anticipated outcomes are to explore and demonstrate: 1) low-cost and low-loss 3D optical interconnects featuring optical vias and optical waveguides capable of handling 400 Gbps signaling in one waveguide, 2) low loss high speed electrical connection to drive 400 Gbps optical signaling, 3) 3D assembly of photonic and electronic ICs, and 4) high alignment tolerance connection from die to optical fibers featuring vias, turning waveguides, and passive alignment grooves. A schematic of the 3D GP program with four key building block research tasks is shown below.
3D Glass Photonics Program Objectives with four key building blocks.
For more information about 3D Glass Photonics research at GT PRC, please contact the PRC.