A System Scaling Center for Smart, Wearable, IOT, Bio-electronics, Automotive and High-performance Systems
The Georgia Tech 3D Systems Packaging Research Center (PRC) is unique in three ways. It goes beyond the traditional exploratory research by faculty and graduate students to an integrated, interdisciplinary and system level approach with particular focus on: 1) leading-edge electronic and bio-electronic systems research, 2) cross-discipline education of large number of graduate and undergraduate students, and 3) industry collaborations with more than 50 companies from the U.S., Europe, Japan, Korea, Taiwan and China, all in one transformative systems technology called System Scaling to nanoscale leading to the entire System-On- one single Package (SOP), being pioneered by the Center.
In research, it is pioneering System-on-Package (SOP) in contrast to system-on-chip that ends up with system-on-a bulky board with other components. Such a concept is expected to revolutionize ultra-miniaturized consumer electronics and bio-electronics systems such as smartphones, wearable, Internet of Things (IOTs), miniaturized electronics as well as ultra-high performance computing systems. This is due to the fact that the fundamentals of system scaling of components to nanoscale and ultra-short interconnections between these and active devices leads to higher performance as well as lower power dissipation in the interconnections, as a result of ultra-short interconnections; lower cost as a result of large panel processing; improved functionality as a result of SOP integration; and improved reliability as a result of matched TCEs or compliant interconnections at all levels. As these system scaling technologies are explored, developed and designed with nanoscale components, smart systems such as smartphones are expected to trend to mega-functional systems at lowest cost in smallest size that every global person could afford. These systems using system scaling technologies will perform dozens of functions that include Wireless Electronics, Healthcare Electronics, Wearable Electronics, Sensor Electronics, Camera Electronics, 5G and mm-wave Electronics, Digital Electronics, MEMS Electronics, Photonics, Analog Electronics, Power Electronics and automotive electronics that include all these and many others.
In education, PRC strives to educate globally-competitive and interdisciplinary individuals with knowledge not only in electrical, mechanical, thermal, materials and chemical sciences and engineering but also in theoretical and hands-on practical knowledge, and in addition, learn about industry culture by virtue of every PRC graduate student collaborating with one or more of global PRC member companies. The PRC students therefore are unique as they learn science, technology, manufacturing, business, economics, foreign culture and develop leadership skills.
In global industry collaborations, the PRC collaborates in co-development mode with global companies in materials, tools, processes, semiconductors, packaging, assembly, board and system companies; developing new technologies and transferring both the new technologies and the educated engineers to provide a path for commercialization of SOP-based PRC-developed technologies.