Systems Packaging Classes – at Georgia Tech

System Packaging Classes

Below is a comprehensive list of Packaging Classes taught by Georgia Tech faculty.

Click here to see the comprehensive list of Systems Packaging Classes Taught specifically by Prof. Tummala. 

 

CHE

ECE

ME

MSE

DEVICE PACKAGING

 

 

 

 

4460 Electronic Packaging – Prof. Madavan Swaminathan

Introduction to packaging technologies, technology drivers, electrical performance, thermal management, materials, optoelectronics, RF integration, reliability, system issues, assembly, testing.

 

X

 

 

4754 Electronic Packaging Assembly – Prof. Rao Tummala

The course provides hands-on instruction in electronics packaging, including assembly, reliability, thermal management, and test of next-generation microsystems.

 

X

X

X

DEVICES

 

 

 

 

3040 Microelectronic Circuits – Prof. Muhannad Bakir, Prof. David Cressler  Prof. Russell Dupuis, Prof. Azad Jafari Naeemi, Prof. Stephen Ralph, Prof. Shyh-Chiang Shen

Basic concepts of microelectronic materials, devices, and circuits.

 

X

 

 

3150 VLSI and Advanced Digital Design – Prof. David E Schimmel

Advanced digital design issues in the context of VLSI systems. Introduction to a design methodology that encompasses the range from architectural models to circuit simulation.

 

X

 

 

3400 Analog Electronics – Prof. Hua Wang

Analysis and design of electronic circuits and systems. Biasing, small-signal analysis, frequency response, feedback amplifiers, active filters, non-linear op-amp applications, and oscillators.

 

X

 

 

3450 Semiconductor Devices – Prof. William Alan Doolittle

Properties of semiconductor devices. Applications in current and future computers, fiber optic and wireless communication systems. Future needs of high frequency, GHz-range, device operation.

 

X

 

 

3710 Circuits and Electronics – Prof. Borislav Petrov Alexandrov, Prof. Bonnie Ferri, Prof. Nak-Seung Patrick Hyun, Prof. Prof. Michael Lee, Chang-Shun Liu, Prof. Heqing Mei, Prof. Nathan VerDon Parrish, Prof. Colin Pardue, Prof. Prof. Hossein Taheri

An introduction to electric circuit elements and electronic devices and a study of circuits containing such devices. Both analog and digital systems are considered.

 

X

 

 

3741 Instrument and Electronics Lab – Robert Allen Robinson

Basic analog and digital electronic circuits and principles. Techniques of electrical and electronic measurements with laboratory instruments.

 

X

 

 

4043 Analog Electronics Lab – Prof. Thomas Brewer

Experiments in analog electronics using discrete devices and off-the-shelf integrated circuits.

 

X

 

 

4435 Operational Amplifier Design – Prof. Thomas Brewer, Prof. Hua Wang

Analysis and design techniques for utilization of integrated circuit operational amplifiers for applications in electronic systems.

 

X

 

 

4130 Advanced VLSI Systems – Prof. Arijit Raychowdhury

An advanced treatment of VLSI systems analysis, design, and testing with emphasis on complex systems and how they are incorporated into a silicon environment.

 

X

 

 

4752 IC Fabrication – Prof. Muhannad Bakir, Prof. Albert Bruno Frazier

The objective of this course is to give students exposure to the various steps involved in the fabrication of integrated circuits and devices. This course will include a laboratory segment in which students fabricate MOS transistors, diffused resistors, and MOS capacitors from a bare silicon substrate.

X

X

 

 

4766 Nanoscale Devices  - Prof. Peter Hesketh

Fundamental properties at the nanoscale for photonics and sensors. Nanoscale fabrication methods including thin films, ion beam, lithography, electroplating, and example case studies in NEMS/MEMS and photonics

 

 

X

X

6130 Advanced VLSI Systems - Prof. Arijit Raychowdhury

An advanced treatment of VLSI systems analysis, design, and testing with emphasis on complex systems and how they are incorporated into a silicon environment

 

X

 

 

6133 Physical Design Automat VLSI - Prof. Sung Kyu Lim

Various design automation problems in the physical design process of VLSI circuits including clustering, partitioning, floor planning, placement, routing, and compaction.

 

X

 

 

6450 Microelectronics Technology – Prof. William Alan Doolittle

Presents the fundamentals of microelectronics material, device, and circuit fabrication.

 

X

 

 

6451 Introduction to Microelectronic Theory  - Prof. David Citrin, Prof. Paul Douglas Yoder

Basis of quantum mechanics, statistical mechanics, and the behavior of solids to serve as an introduction to the modern study of semiconductors and semiconductor devices.

 

X

 

 

6458 Gigascale Integration – Prof. Azad Jafari Naeemi

Hierarchy of physical principles that enable understanding and estimation of future opportunities to achieve multibillion transistor silicon chips using sub-0.25 micron technology.

 

X

 

 

6460 Microelectromechanical Devices – Prof. Oliver Brand

Fundamental concepts for design of microelectromechanical devices (MEMS), including mechanical and thermal behavior of materials and structures, transduction principles, transducer design, and modeling.

 

X

 

 

ECE 6414 Analog Integrated System Design – Prof. Maysam Ghovanloo

Design of analog systems using CMOS and bipolar technologies. A higher level of design for analog and digital systems is presented.

 

X

 

 

EMI PACKAGING

 

 

 

 

3025 Electromagnetics – Prof. John Buck, Prof. Morris B Cohen, Prof. Benjamin Klein, Prof. Bernard Kippelen

To present the laws and applications of electromagnetics.

 

X

 

 

4390 Radar and EM Sensing – Prof. Emmanouil M. Tentzeris

Introduces students to radar systems, including pulsed, CW, CWFM, and MTI radars. Other techniques for electromagnetic sensing such as radiometry and EM tagging are discussed.

 

X

 

 

6350 Applied Electromagnetics – Prof. Andrew Peterson

The methodology and application of advanced electromagnetic theory.

 

X

 

 

6380 Introduction to Computational EM – Prof. Madahan Swaminathan

The practical application of the finite-difference time-domain and finite element techniques to electromagnetic problems. Computer projects are required.

 

X

 

 

MEMS AND SENSORS

 

 

 

 

6200 Biomedical Applications for MEMS – Prof. Ali Fatih Sarioglu

MEMS processing technologies, design of fabrication process flows, and applications of the technologies to the development of biomedical micro instrumentation and detection methodologies.

 

X

 

 

6229 Introduction to MEMS – Prof. Todd A Sulchek 

Introduction to Micro-Electro-Mechanical systems: Microfabrication techniques including: photolithography, etching, physical and chemical vapor deposition, electroplating, bonding and polymer processing. Application to sensors and actuators.

X

X

X

 

6422 Interface IC Design – Prof. Farrokh Ayazi 

Design of high-performance integrated interface circuits for various MEMS and sensing devices. System level issues in integrated microsystems.

 

X

 

 

OPTICAL PACKAGING

 

 

 

 

3015 Electrical, Optical and Magnetic Properties – Prof. Eric M Vogel 

Introduction to quantum mechanics and the band theory of solids to describe semiconducting, superconducting, dielectric, optical, and magnetic properties of nano- and micro-structured materials.

 

 

 

X

4500 Optical Engineering – Prof. Wenshan Cai

Introduction to applications of geometric, physical optics to engineering, including optical measurements, matrix methods, instruments, interference, holography, beam optics, Fourier optics, and diffraction.

 

X

 

 

6540 Organic Optoelectronics – Prof. Bernard Kippelen

Fundamental understanding of the optical and electronic properties of organic materials and devices that form the basics of the emerging technological area of printed flexible optoelectronics.

 

X

 

 

6542 Optoelectronic Systems – Prof. Gee-Kung Chang, Prof. David Citrin

Optoelectronic devices (detectors, emitters, modulators) from the practical realized and theoretical performance perspective. Explores monolithic and hybrid integration of devices, packaging, and system implementation.

 

X

 

 

6771 Optoelectronics – Prof. Thomas K Gaylord

Optoelectronic materials, physical processes, and devices. Includes compound semiconductor materials, ex3043citation, recombination, gain, and modulation processes and devices such as emitters, detectors, and modulators. Crosslisted with PHYS 6771.

 

X

 

 

PACKAGE DESIGN: ELECTRICAL

 

 

 

 

6412 Analog Integrated Circuit Design – Prof. Gabriel Alfonso Rincon

Design of analog circuits using CMOS and bipolar technologies.

 

X

 

 

PACKAGE DESIGN: MECHANICAL

 

 

 

 

3017 System Dynamics – Prof. Ye-Hwa Chen, Prof. Yong Tae Kim, Prof. Nader Sadegh

Dynamic modeling and simulation of systems with mechanical, hydraulic, thermal and/or electrical elements. Frequency response analysis, stability, and feedback control design of dynamic systems.

 

 

X

 

6124 Finite-Element Method – Prof. Suresh Sitaraman

Line, plane, solid, plate, and shell elements-theory: practical aspects of modeling; applications in mechanical engineering; final project.

 

 

X

 

PACKAGING MATERIALS

 

 

 

 

6010 Functional Materials – Prof. Meilin Lu

This course focuses on the effects of defects on physical properties; charge/mass transport; semiconductors, heterojunctions, electrical and magnetic polarization, interaction processes between various physical properties; electrical characterization techniques.

 

 

 

X

6510 Electro Optics – Prof. Wenshan Cai 

Study of the fundamental principles and primary applications of lasers, and of detectors of optical radiation.

 

X

 

 

PACKAGING SUBSTRATES

 

 

 

 

4755 Packaging Substrate Fabrication – Prof. Rao Tummala

This course provides students with hands-on instruction in basic SOP concepts and techniques, including interconnect design, substrate material selection and properties, photodielectric deposition, via formation and photolithography, copper metallization, and finally, substrate testing.

X

X

X

X

POWER PACKAGING

 

 

 

 

4320 Power System Analysis & Control – Prof. Ronald G Harley

Introduces basic concepts in electric power generation, distribution, system control, and economic operation.

 

X

 

 

4321 Power System Engineering – Prof. A P Meliopoulos

To introduce basic concepts of electric power system design, encompassing protection, stability, and control.

 

X

 

 

4330 Fundamentals of Nanomaterials and Nanostructures – Prof. Dong Qin

Introduction to nanotechnology. Description of various nanomaterials, their applications and synthesis methods.

 

 

 

X

4330 Power Electronics – Prof. Maryam Saeedifard

Introduces power semiconductor devices and power electronic converters, including single-phase and three-phase ac/dc rectifiers, ac voltage controllers, dc/dc converters, and dc/ac inverters.

 

X

 

 

6254 Stat Digital Signal Processing and Modeling – Prof. Mark Andrew Davenport

Introductory course in digital signal processing, and includes the following topics: signal modeling, optimum filters, and power spectrum estimations.

 

X

 

 

6320 Power System Control & Operations – Prof. A P Meliopoulos

Introduction to methods used in the real-time operation and control of power systems as well as to the hardware and software technology of energy management systems (EMS).

 

X

 

 

6331 Power Electronic Circuits – Prof. Maryam Saeedifard

The analysis, control, and design of switching power converters: rectifiers, cycloconverters, voltage-sourced and current-source inverters, DC-DC converters, PFC and resonant converts.

 

X

 

 

RF PACKAGING

 

 

 

 

6360 Microwave Design – Prof. Madhavan Swaminathan

Applications of electromagnetic theory to microwave components and systems. Introduction to the latest characterization and design techniques including monolithic microwave integrated circuit (MMIC) technology.

 

X

 

 

6420 Wireless IC Design – Prof. Hua Wang

Wireless system specifications are translated to architectures and building blocks compatible with silicon technology. The course focuses on the analysis and design of these blocks.

 

X

 

 

SYSTEMS PACKAGING

 

 

 

 

6776 Microelectronic System Packaging – Prof. Rao Tummala

Broad overview of system-level, cross-disciplinary microelectronics packaging technologies, including design, test, thermal, reliability, optoelectronics, and RF integration. Comparison of system-on-chip and system-on-package.

 

X

X

X

TEST

 

 

 

 

3041 Instrument and Circuits Lab

Fundamental experimental techniques for the laboratory analysis of signals and passive electrical circuits using basic electronic test and measurement instrumentation. Component characterization, computer-automated measurements, and simulation. Technical writing. Credit not allowed for both ECE 3041 and ECE 3043.

 

X

 

 

3043 Circuit & Electronics Lab – Prof. Thomas Elmo Brewer

Basic electronic test instrumentation. Elementary passive and active circuits using both discrete (diodes, bipolar junction transistors, MOSFETs) and integrated devices (operational amplifiers). Credit not allowed for both ECE 3043 and ECE 3041.

 

X