Apr 6, 2018 | Atlanta, GA
Introductory and Undergrad Textbook with all the Latest Device and Systems Packaging and Package Integration Technologies
“Fundamentals of Electronic Device and Systems Packaging Technologies”
Prof Rao Tummala
This introductory and undergrad textbook defines the new and emerging vision for packaging as interconnecting, powering, cooling and protecting, not only devices, but all system components to form systems like smartphones. It also sets the stage for both homogeneous and heterogeneous package integration at device level, initially, and entire system-on-package in about a decade. Currently, all devices are packaged individually or in multiples in 2D, 2.5D and 3D architectures by two different approaches, chip-last and chip-first. They are also produced from wafer fabs and from package fabs. They are then assembled onto system boards. This leads to interconnecting all devices and other components through the board, making the interconnection lengths at system levels about 20-100X more than the interconnection length between the IC and package.
This book divides packaging into 3 eras - Packaging in the Moore’s Law era, with focus on SOC; Packaging in the post Moore’s Law era, with focus on 2.5D and 3D MCMs, also called More than Moore; and ultimately packaging the entire system-on-package (SOP), referred to as System Moore. In this scenario, only two frontier technologies are necessary to form any system—Transistor scaling by Moore’s Law and System Scaling by System Moore or second law of electronics, yet to be developed.
This book introduces the concept of packaging to consist of 10 or so core packaging technologies to form any electronic system. This includes electrical design, mechanical design, thermal design and technologies, materials and processes for electronic, photonic, wireless to 5G and millimeter wave, substrate wiring and I/Os, interconnections and assembly, passive components, sealing and encapsulation. This book is organized in exactly the same way, with all these technologies. In addition, the book builds advanced packaging architectures in 2D, 2.5D and 3D using these basic technologies. It goes one step further to describe the latest and emerging packaging technologies at system level.
Finally, the last chapter describes how all these basic technologies are applied for a variety of next-generation applications that include: computing, communications, bio-medical, automotive, consumer such as smartphone, IoT, flexible and wearable electronics.
The book is being authored and edited by Prof. Rao Tummala with contributions from many of the world’s leading experts including Prof. Tummala’s colleagues at Georgia Tech and elsewhere, and his students at Georgia Tech. Karen May, Prof. Tummala’s Assistant, has been acting as the overall coordinator for creating the manuscript.
The book is expected to be available by the end of 2018 from McGraw-Hill.