Programs

Overview

Georgia Tech PRC offers a single industry consortium with many programs, each with many projects, customized to each of the participating full member. Each Program is led by an experienced Program Man manager and the Program includes a team of Academic Faculty, experienced engineers, Graduate Students, On-campus Industry Engineers, as well as Interns from Other Universities.

Why Collaborate with Georgia Tech PRC

No. 1 Academic Leader in IC & Systems Packaging

  1. Technical Vision Consistent with Market Needs
  2. Co-development of Panel-based Glass Packaging with 50 Global Researchers, Developers, Manufacturers and users
  3. Explore and Develop Advanced Systems Packaging Technologies Beyond Industry’s 3-year Horizon
  4. Seamless from R&D, Prototype, and Tech Transfer Enabling Commercialization
  5. Track Record of Technology Breakthroughs
  6. Only 300mm Cleanroom Panel Facility in the Academic World
  7. 50 Person Co-development Team: Full-time Researchers, Manufacturing Industry Partners, Graduate Engineers, Faculty and On-campus Industry Engineers

2014-2016 Industry Consortia Programs

Automotive Electronics Industry Consortia Planned for 2016-2018

The new trends in automotive electronics such as autonomous driving, in-car smartphone-like infotainment, privacy and security, and all-electric cars, require an entirely different vision than is pursued currently. Georgia Tech sees unprecedented challenges and opportunities to address these disparate sets of technologies that were heretofore thought to be impossible to integrate. It proposes a systematic approach to system scaling, heterogeneous integration and innovative package architectures to serve as the new era in automotive electronics hardware with particular focus in electrical, mechanical and thermal designs and new digital, RF, sensors, millimeter-wave and power technologies. The Georgia Tech team proposes a transformative and strategic approach to automotive electronics, called System Scaling, leading to entire automotive system-on- a package in a decade. Such a system must integrate many disparate technologies such as high-speed digital, optical, RF and wireless sensing as well as data processing from 100s of sensors and integration of ultra-high power devices. Georgia Tech proposes a highly innovative large panel-based, ultra-thin glass packaging in 3D double-side SOP architecture with many, many innovations in designs, materials, processes, wiring lithography, highly-conductive through-vias, interconnections, thermal structures and system integration of all these into ultra-miniaturized, high-performance, low-cost and high-reliability electronics. Such an approach is proposed to lead to highly-functional systems with disparate sets of technologies at lowest cost, in smallest ultra-miniaturized size with shortest interconnections with lowest power consumption. Georgia Tech views this approach to be superior to current approaches such as chip-first or wafer fanout and chip-last with organic, leadframe and molded packaging technologies.

Automotive Electronics Faculty Expertise