Laboratory Capabilities

SOP Substrate & Systems Integration Lab

This is a class 1,000 clean room facility maintained at 68F and relative humidity of 35%. This test bed and prototype research laboratory enables the processing of 300 mm substrates and interposers such as organic, glass, flex, ceramics and silicon with via formation and metallization, high density wiring (HDW), embedded and integral passive components. Process capabilities in this laboratory include substrate cleaning and preparation, polymer deposition of wet films, polymer deposition of dry films via roll or vacuum lamination, soft bake and final film curing, full field photolithographyfor feature development, and feature inspection and characterization, both electrolytic and electroless copper plating for build-up, gold, nickel and solder for surface finish, which enable metallization of substrates to the parameters defined in PRC's research program. Equipment includes:

* Drawer Vacuum Laminator

* Full Field Exposure System 

* Projection Lithography

* Nitrogen Purge Ovens 

* Optical Microscopes 

* Stylus and Non-contact Surface Profilers

* Chemical Processing Hoods

* Electro/Electroless Plating System

* Horizontal Spray Develop/Strip/Etch Systems

* Dry/Cure Ovens

* Large Area Spin Coaters 

* Large Area Spin/Rinse/Dry

* Electrical Characterization Probe Station / 4 Point Mesurement 

* Plasma Surface Preparation


SOP Assembly & Reliability Lab

The SOP Module Assembly Laboratory provides a class 100,000 environment enabling the research and process integration needed to assemble functional sub-system test vehicles. In this laboratory, substrates processed in the SOP Substrate Fabrication are assembled into a complete sub-system prior to environmental reliability, electrical and functional testing. Current process capabilities of this facility include precision stencil printing, thermocompression bonding, wirebonding, solder reflow, precision chip and component placement and bonding by various techniques, component and substrate inspection via X-ray and acoustical measurement, materials dispense, reliability testing, and material and process characterization. Tools in this lab include:

* Semiautomatic Flip Chip Bonding

* Automated Flip Chip Bonding

* Thermal Bake Ovens

* Xray Inspection

* Optical Measurement of Features

* Waterjet Cutting

* BGA Reworks

* Sonoscan CSAM

* Semiautomated Screen Printing

* Die Shear Testing

* Wire Bonding

* Liquid to Liquid Shock 

* Air to Air Shock and Cycling

* HAST Testing

* Nitrogen Atmosphere Solder Reflow

‚Äč* Warpage Characterization


Industry Materials, Tools, Software and Process Service Support

The PRC encourages industry participation in Infrastructure support. These include:

* Infrastructure Partnership – on a consignment basis, and working with industry, the PRC Testbed and Prototype laboratories offer companies a mechanism to apply their materials, tools, and process services to create leading-edge, next-generation prototypes, enabling industry to understand the future needs and demonstrate their infrastructure capabilities.

* By providing highly discounted purchases for unique critical equipment – in situations where budgets permit, the Center funds critical equipment purchases which can be included during the proposal submission process

* Supply Chain Membership in Research Consortia - companies can offset a portion of membership costs with “In-kind” support of program critical materials, tools, software, and process services.