Georgia Tech and its industry partners have developed the most advanced package-level electromagnetic interference (EMI) shielding structures for emerging highly-miniaturized system packages.
What's New @ GT in Packaging? Ultra-thin Dry Film Polymer Materials and Processes for High-density 2.5D and Fan-out Packages
Georgia Tech and its industry partners are developing the next generation of ultra-thin polymers to form 20-40µm pitch RDL for 2.5D and Fan-out packages.
What's New @ GT in Packaging? Advanced Molding Compounds for Fan-out and High-temperature Automotive Electronics
Georgia Tech and its industry partners are developing a new class of molding compounds with superior thermal stability and reliability up to 250°C for a variety of applications, including high-power automotive electronics, and wafer and panel fan-out packages.
Georgia Tech and its industry partners are developing 5G and mm-wave packaging using ultra-thin Glass panel Fan-out technology with 10-100X improvement in bandwidth for consumer, computer, communication and automotive applications.
Georgia Tech and its industry partners develop next generation of ultra-thin and ultra-high I/O density panel and wafer fan-out packaging to close the interconnect gap for digital applications, thickness or miniaturization gap for analog, power, RF and mm-wave applications, and power and thermal gap for high-power applications.
Georgia Tech and its industry partners demonstrate 3D Glass Photonics for ultra-high bandwidth, low cost and low power.
Georgia Tech and its industry partners have demonstrated major advances in glass-based High-Q inductors in thickness and Quality Factor.
Georgia Tech and its industry partners demonstrate pioneering advances in 3D Glass-based RF modules and Integrated Passive Devices (3D IPDs) as the next stage of evolution.
Georgia Tech and its industry partners have developed 2.5D glass interposer technology as a superior alternative to organic interposers in interconnect density, and silicon interposers in electrical performance, power consumption, and cost.
High throughput small through-package-vias (TPV) holes and metallization processes are developed, as well as low cost RDLs with 2-5 micron wiring leading to 20-40 micron I/O pitch on both sides of thin glass.