TechSearch International, Inc.
Packaging challenges for ADAS sensors
New automotive safety features include improved self-diagnostics, crash avoidance technology, and advanced driver assistance. This translates into increase use of image sensors, LiDAR, and radar. Multiple combinations of sensors are anticipated. What types of semiconductor packages are used in these new automotive electronics and what are the future challenges as new package types are adopted? This presentation discusses some of the opportunities in automotive packaging and the challenges in meeting automotive specifications.
About the Speaker
E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the co-author of How to Make IC Packages (by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE CPMT and is an IEEE CPMT Distinguished Lecturer. She is a member of SEMI, IMAPS, and SMTA.