Graduate Research Assistants

  Student Research Focus
Muhammad Ali
ECE MS
 
5G Packaging
Advanced Substrates, Modeling, Design, Fabrication and Characterization of Transmission Lines, Passives and integrated Antenna Arrays​
Chintan Buch 
ECE MS
3D Glass Packages for Sensing Electronics​
Design and Demonstration of low cost, high reliability ultra-thin 3D glass packages for sensors​
Sangbeom Cho
ME PhD
Glass Interposer Thermal Design
Thermal Characterization of Glass with Copper Structures, and Design /Demonstration of Cooling Device for Glass Interposer in Mobile Application
Bartlet Depropso
MSE PhD
2.5D Glass Interposers
Design and Demonstration of Large and Ultra-thin 2.5D Glass Interposer with TB/s System Bandwidth​
Shreya Dwarakanath
MSE PhD
High-Temperature Materials and Reliability    
Inorganic/organic hybrid materials as novel dielectric materials for high-temperature RDL 
Yunyi Gong
ME PhD
77 GhZ SiGe Automotive Radar Receiver
Design and Demonstration of High Linearity Low Noise 77 GHz Automotive Radar Receiver ​
Ting-Chia (Nathan) Huang
MSE PhD
Interconnections
Solder-based first level interconnections (FLIs) at 20μm pitch
Tim Huang
MSE PhD
Glass Interposer Metallization
Studies of interfacial adhesion and copper plating chemistry for metallization of through-package-vias in glass interposers
Vidya Jayaram
MSE MS
System-level Reliability of Large 2.5D Glass BGA Packages​
Modeling, Design and Demonstration of Warpage Mitigation and System-Level Reliability of Large 2.5D Glass BGA packages​
Min Suk Kim
ECE PhD
3D Integrated Passive and Active Components
Modeling, Design and Demonstration of RF Power Amplifier Module on Ultra-miniaturized Glass with Efficient Thermal Dissipation
Haksun Lee
ECE PhD
High Power Electronics   
Design and Demonstration of High-Frequency GaN DC-DC Converters with Integrated-Magnetics for (H)EVs​
Hao Lu
ECE PhD
2.5D Glass Interposer Design and Demonstration 
Modeling, Fabrication and Characterization of Impedance Controlled 2 Micron Multilayer RDL for 20 Micron Bump Pitch Glass Interposers
Scott McCann
ME PhD
Mechanical Reliability of Glass Interposers
Mechanical Design and Demonstration of Glass Interposer for Low Warpage and High Reliability
Chandra Nair
MSE PhD
2.5D Glass Interposers/ Panel-based RDL
Modeling, design, fabrication and characterization for reliability of panel-based redistribution layer (RDL) technology at 20 µm pitch for high density fan-out substrates/interposers
Brett Sawyer
ECE PhD
2.5D Glass Interposers
Design and Demonstration of Large and Ultra-thin 2.5D Glass Interposer with TB/s System Bandwidth
Ninad Shahane
MSE PhD
First Level Interconnections
Low-temperature and Ultra-low Pressure Cu Interconnections without Solder using Thermocompression Bonding for Low-cost High-throughput Assembly
Tailong Shi
ECE PhD
Glass Fan-out Package
Design and demonstrate an ultra-thin, panel-level glass fan-out package (GFO) to serve as the next generation of fan-out packaging for high density digital and high performance analog, power, RF and mm-wave applications 
Grant Spurney 
MSE PhD
High Density Capacitors   
Design and demonstration of high capacitance density tantalum capacitors in a panel-array format with ultra-low profiles​
Teng Sun 
MSE PhD
Thin-film power inductors​
Thin-film power inductors
Design and Demonstration of advanced thin-film power inductors with high inductance, high current handling and low resistance
Yuya Suzuki 
MSE PhD
2.5D Glass Interposer Design and Demonstration   
5 µm dry-film polymer dielectric material and 5 µm micro-via process for RDL application​
Chia-Chi (Kathy) Tuan 
MSE PhD
High-temperature molding compounds​
Design molding compound materials for high-temperature operations​
Atom Watanabee  
ECE PhD
EMI Shielding (R&D)   
Research on innovative shield materials and structures with highest shielding effectiveness
5G and Beyond (D&D)
Design and Demonstration of 3D glass module technologies for 5G applications
Zihan Wu
ECE PhD
 
2.5D Organic Interposer
Modeling, Design and Demonstration of Low Cost High Density 2.5D Organic Interposer at 40μm Bump Pitch