Leading-edge electronic and bio-electronic systems research,
Cross-discipline education of students,
- Industry collaborations with more than 70 companies from the U.S., Europe and Asia all in one transformative systems technology called System-On-Package, pioneered by the Center.
In research, the PRC is pioneering System-on-Package (SOP). Such a concept has begun to revolutionize ultra-miniaturized consumer electronics and ultra-high performance computing systems. As these systems are explored with nanoscale components, electronic systems are expected to trend to mega-functional computing, communication, and bio-sensor systems at lowest cost in smallest size.
In education, PRC strives to educate globally-competitive and interdisciplinary individuals with knowledge not only in electrical, mechanical, thermal, materials and chemical sciences and engineering – but also in theoretical and hands-on practical knowledge.
In global industry collaborations, the PRC collaborates with 70+ companies to transfer both the new technologies and the educated engineers to provide a path for commercialization of SOP-based technologies. As a result, graduate students are globally engaged with global industry and hit “the ground running” when they join companies upon graduation.
In facilities and labs, the PRC has state-of-the-art 300mm SOP wafer fab facilities from design-to-manufacturing and prototype development. In addition, it has access to fundamental research labs in electrical, thermal, materials research and characterization.
In leadership, the PRC is headed by a globally recognized expert in microelectronics and packaging – Prof. Rao R. Tummala. Additionally, all graduate students are mentored by expert research faculty in PRC’s core areas.
In opportunities, PRC graduates historically receive higher salaries upon graduation, and work for the best companies and universities globally.
For more information, contact the PRC.