chips header

The Georgia Tech 3D Systems Packaging Research Center (PRC) is a graduated NSF Engineering Research Center focusing on advanced packaging and system integration leading to System on Package (SoP) technologies. The center conducts research and education in all aspects of packaging that includes design, materials, process, assembly, thermal management and integration driven by applications, which include broad areas such as high performance computing, artificial intelligence, automotive, broad band wireless and space. The center team consists of 29 faculty from five schools, 11 research/administrative staff, 50+ graduate/undergraduate students and several visiting engineers. This is enabled through collaboration with 48 industry/govt. organizations and 14 universities.